Flexible Printed Circuit Board
Information
Process Outline
1. Design: CAD/CAM
design in-house. The design which considered production is performed.
2. NC Drilling
Hole dawn processing for through holes is performed.
3. Copper Plating processing
Plating for thorough holes is performed. Chemicals control in-house.
4. Resist Coating
Resist is stuck on FPC.
(Work in a clean room)
5. It exposes to Resist.
It draws a picture with an automatic machine on Resist.
(Work in a clean room)
6. Copper Etching
A place without Resist is etched.
7. Cover lay adhesion
A cover lay is stuck on FPC. cover lay is an insulator.
(Work in a clean room)
8. Plating processing
It plates on copper.
Chemicals control in-house.
9. Blanking
Blanking
10. Inspection
All specialists inspect.
11. Product completion!
Guarantee of quality
X-Ray Fluorescence Analysis The thickness of plating is measured.
The characteristic and differential impedance of a product It measures.
AOI (automatic inspection machine)
Chemicals fluid management / analysis Plating, surface treatment, etc.
Medical fluid-related analysis to be used.
It carries out periodically.